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Thermal insulation adhesive

  • 511 radiant flame retardant electronic silica rubber
  • 511 radiant flame retardant electronic silica rubber
511 radiant flame retardant electronic silica rubber511 radiant flame retardant electronic silica rubber

511 radiant flame retardant electronic silica rubber

  • Product description: Bonding, sealing, fixing, filling, moisture-proof and insulation of all kinds of PCB heating electronic components. Power module assembly and reinforcement, lamp assembly, auto parts assembly.
  • INQUIRY
I. [Product Features]
1, one component room temperature curing silicone rubber, no solvent, no corrosion, low odor, after curing for the elastomer
2, gray, fast drying type, paste glue, after curing the colloid impact and vibration resistance
3. Excellent thermal conductivity, which can effectively disperse the heat generated by electronic components into the environment, thus prolonging the service life of electronic components, excellent flame retardant performance and electrical insulation performance
4, curing material on metal, plastic and other materials are no corrosion, weather resistance, aging resistance, superior electrical performance
5, curing material has good seismic, shockproof, shock absorption, strong adhesion, good sealing
6, after curing, colloid insulation, moisture-proof, non-swelling, in line with the RoHS directive requirements
Two, [scope of application]
Yaoneng 511 RTV heat conduction flame retardant electronic silica gel (organic silica gel) applicable to the following range:
1. Bonding, sealing, fixing, filling, moisture-proof and insulation of all kinds of PCB heating electronic components.
2. Power module assembly and reinforcement, lamps assembly, auto parts assembly.
3. It is used for the assembly of heat sink and CPU, audio-visual, electronic and electrical appliances and other related parts that need heat dissipation and heat transfer, such as semiconductor refrigeration pieces, water dispensers, electric ketts, TV power amplifier tubes and heat sink.

4, used for metal, glass, ceramics, PCB board, semiconductor devices, plastics and other objects bonding, heat dissipation, sealing, fixing.

IV. [Usage]
1, clean: clean the surface of the construction substrate dust, water, oil and other impurities, and keep dry.
2, sizing: the glue is extruded and coated on the surface of the substrate, and then the other side is glued.Do not force the bonding part before the complete curing, so as not to affect the curing and bonding strength.Good ventilation should be maintained during sizing and curing.
5. [Precautions]
1, sizing and curing process can not be operated in a closed environment, should maintain good ventilation.
2, the production process should strengthen ventilation and personal protection work, prohibit open fire, and away from the source of fire and heat source.
3, handling light, packaging cover should be promptly covered, not used up glue should be sealed well.
4, the test of the performance parameters should be carried out at least 48 hours after sizing, at this time the glue is completely cured.
5. For more data and information, please consult Shenzhen Yaoneng Company for relevant advice and help.
VI. [Packaging and Storage]
1. This product is packed in 100ml/ piece, 300ml/ piece.
2. This product is a general product, stored sealed in a ventilated, dry, cool, dark place, shelf life of 10 months.